Thick Film Circuit Design Guidelines
The experienced team at Hybrid-tek will work closely with you on your hybrid program from start to finish – from circuit design and layout assistance through final package assembly, testing, documentation, and delivery – or any stage in between. You will have the assurance of the highest possible quality with 100% useful parts.
Hybrid-tek has been setting the standard and leading the industry for 30+ years.
Hybrid-tek supports worldwide concerns that metals mined in conflict areas of the Democratic Republic of the Congo (DRC) may be making their way into the electronics supply chain.
Our policy requires supply chain partners certify in writing they do not knowingly procure their material from conflict areas of the DRC.
We do everything within our power to comply with Section 1502 (the “Conflict Minerals Provision”) of The Dodd-Frank Wall Street Reform and Consumer Protection Act
to ensure that our materials are not only the finest quality but also ethically obtained.
*Dimensions are in inches unless otherwise stated.
| Substrate |
Nominal Thickness:
-Al2O3 (Alumina 96%, 99.6%)
-ALN (Aluminum Nitride) BeO (Beryllium Oxide)
-BeO (Beryllium Oxide) |
10, 15, 25, 30, 40, 50, 60 mils +/-.005
Other thickness can be achieved by way of lapping |
| Conductor |
Line Width (min.)
Al203, ALN, BeO, Ferrite |
0.004 |
| Space Width (min.) |
0.006 |
| Thickness (typ.) |
8-12 + microns/layer |
| Pull back (from diced edges, min.) |
0.004, 0.010, 0.004 |
| Pull back(from scribed edge, min) |
0.004, 0.010, 0.004 |
| Pull back (from edge of dielectric, min.) |
0.004, 0.010, 0.004 |
| Alignment (front to back) |
0.004-0.008 |
| Resistor |
| Line Width (min) |
0.10-0.005 |
| Space Width(min.) |
0.010-0.005 |
| Minimum width relative to conductor width |
0.010 less, centered |
| Minmim Overlap With Conductor |
0.005-0.003 |
| Parameter |
| Minimum Value |
as low as 1mΩ |
| Maximum Value |
1 GΩ or higher |
| Multiple Resistors (on one side of chip) |
Yes, parameter defined |
| Typical Tolerance (value) |
1%, 2%, 5%, 10% |
| Minimum Chip Size |
0.050x 0.050 |
| Minimum Overlap |
0.003 |
| Vias (filled or plugged through holes) |
| Diameter (min, max) |
0.005, 0.20
depending on board & thickness |
| Minimum metal overlap of pads |
0.010 |