Standard Processes |
Description |
Print & Fire |
Circuit Fabrication |
Metalizing |
Types of Metalizing |
Layers: |
-Single-Layer |
CONDUCTORS |
-Multi-Layer |
Au, Pt, PtAu, PdAu, PtPdA |
-Double Sided |
Ag, PtAg, PdAg, PtPdAg |
Plated-thru Vias / Hole |
Connection top to bottom circuitry or to ground |
Solid-filled Vias / Hole |
Connection top to bottom circuitry or to ground |
Dielectric |
Protection for underlying circuitry |
Edge Plating / Printing |
Connection to surface mount resistors |
Thick Film Printed Resistors |
Alternative to surface mount resistors |
Overglaze |
Protection for underlying circuitry |
Ceramic Standard Substrates |
Surface Finish |
91% Alumina |
As Fired, Lapped, Polished |
92% Alumina |
As Fired, Lapped, Polished |
96% Alumina |
As Fired, Lapped, Polished |
99.6% Alumina |
As Fired, Lapped, Polished |
Aluminum Nitride (Aln) |
Lapped, Polished |
Beryllium Oxide (BeO) |
As Fired, Lapped |
Specialty Substrates |
Surface Finish |
Ferrite |
Lapped, Polished |
Glass |
Lapped, Polished |
Macor |
Lapped, Polished |
Quartz |
Lapped, Polished |
Substrate Processing |
Info |
Laser Scribe |
Single / Array |
Laser Drill |
Vias / Holes |
Laser Machining |
Per Specification |
Diamond Saw Cut |
+/- .002″ Tolerance |
Assembly |
Ceramic, PCB, other board types |
Surface Mount (SMT):
-Conductive, Non Conductive epoxy
-Solder reflow
-Solder lead / pin attachment |
Circuit population using active & passive components |
Wire Bonding |
Die attach circuit populationg-semiconductors |
Gold ball |
.001″-.003″ mil wire |
Gold wedge |
.0005″-.003″ mil wire |
Aluminum wedge |
.001″-.003″ mil wire |
Product Testing/Measurement |
On HTI-Produced Units |
Physical Dimensions(ceramic) |
Verify conforming to customer specification |
Continuity / Netlist Connection integrity |
Resistor Measurement Value verification / Data Recorded |
Metallization Adhesion |
Leach resistance (verify adhesion) |
Trace Thickness & Width (conductor, etc) |
Verify conforming to customer specification |
Wire Bond Qualification / Pull Testing |
Bond strength |
Wire Bond Qualification / Shear Testing |
Bond strength |
Burn-in |
Circuit stabilization |
Performance |
Design confirmation |
Environmental |
Endurance verification |
Leak Testing Using Fluid |
Verify Hermetic seal |
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Engineering/Support/CAD |
Leading to HTI circuit fabrication |
Circuit Conversion |
Convert from PCB (G10/FR4) |
Artwork Generation |
For circuit pattern definition |
Advanced Processes |
Ceramic-based circuits / items |
Packaging, Potting & Encapsulation |
Ceramic, Glass Fiber Filled Plastic, Diallyx Phthalate |
Ceramic Glass Sealing |
Ceramic Packages |
Photo Patterned Thick Film (Etched) |
Fine Line Geometries (0.0015″):
-High Speed Circuits (>50GHz)
-High Density Circuits
-High Temperature Circuit |
Plated up thick film circuits |
High Current/High Power:
-Ni, Cu, Au |