| Standard Processes |
Description |
| Print & Fire |
Circuit Fabrication |
| Metalizing |
Types of Metalizing |
| Layers: |
| -Single-Layer |
CONDUCTORS |
| -Multi-Layer |
Au, Pt, PtAu, PdAu, PtPdA |
| -Double Sided |
Ag, PtAg, PdAg, PtPdAg |
| Plated-thru Vias / Hole |
Connection top to bottom circuitry or to ground |
| Solid-filled Vias / Hole |
Connection top to bottom circuitry or to ground |
| Dielectric |
Protection for underlying circuitry |
| Edge Plating / Printing |
Connection to surface mount resistors |
| Thick Film Printed Resistors |
Alternative to surface mount resistors |
| Overglaze |
Protection for underlying circuitry |
| Ceramic Standard Substrates |
Surface Finish |
| 91% Alumina |
As Fired, Lapped, Polished |
| 92% Alumina |
As Fired, Lapped, Polished |
| 96% Alumina |
As Fired, Lapped, Polished |
| 99.6% Alumina |
As Fired, Lapped, Polished |
| Aluminum Nitride (Aln) |
Lapped, Polished |
| Beryllium Oxide (BeO) |
As Fired, Lapped |
| Specialty Substrates |
Surface Finish |
| Ferrite |
Lapped, Polished |
| Glass |
Lapped, Polished |
| Macor |
Lapped, Polished |
| Quartz |
Lapped, Polished |
| Substrate Processing |
Info |
| Laser Scribe |
Single / Array |
| Laser Drill |
Vias / Holes |
| Laser Machining |
Per Specification |
| Diamond Saw Cut |
+/- .002″ Tolerance |
| Assembly |
Ceramic, PCB, other board types |
Surface Mount (SMT):
-Conductive, Non Conductive epoxy
-Solder reflow
-Solder lead / pin attachment |
Circuit population using active & passive components |
| Wire Bonding |
Die attach circuit populationg-semiconductors |
| Gold ball |
.001″-.003″ mil wire |
| Gold wedge |
.0005″-.003″ mil wire |
| Aluminum wedge |
.001″-.003″ mil wire |
| Product Testing/Measurement |
On HTI-Produced Units |
| Physical Dimensions(ceramic) |
Verify conforming to customer specification |
| Continuity / Netlist Connection integrity |
Resistor Measurement Value verification / Data Recorded |
| Metallization Adhesion |
Leach resistance (verify adhesion) |
| Trace Thickness & Width (conductor, etc) |
Verify conforming to customer specification |
| Wire Bond Qualification / Pull Testing |
Bond strength |
| Wire Bond Qualification / Shear Testing |
Bond strength |
| Burn-in |
Circuit stabilization |
| Performance |
Design confirmation |
| Environmental |
Endurance verification |
| Leak Testing Using Fluid |
Verify Hermetic seal |
|
|
| Engineering/Support/CAD |
Leading to HTI circuit fabrication |
| Circuit Conversion |
Convert from PCB (G10/FR4) |
| Artwork Generation |
For circuit pattern definition |
| Advanced Processes |
Ceramic-based circuits / items |
| Packaging, Potting & Encapsulation |
Ceramic, Glass Fiber Filled Plastic, Diallyx Phthalate |
| Ceramic Glass Sealing |
Ceramic Packages |
| Photo Patterned Thick Film (Etched) |
Fine Line Geometries (0.0015″):
-High Speed Circuits (>50GHz)
-High Density Circuits
-High Temperature Circuit |
| Plated up thick film circuits |
High Current/High Power:
-Ni, Cu, Au |