| Standard Processes | Description |
|---|
| Print & Fire | Circuit Fabrication |
| Metalizing | Types of Metalizing |
|---|
| Layers: |
| -Single-Layer | CONDUCTORS |
| -Multi-Layer | Au, Pt, PtAu, PdAu, PtPdA |
| -Double Sided | Ag, PtAg, PdAg, PtPdAg |
| Plated-thru Vias / Hole | Connection top to bottom circuitry or to ground |
| Solid-filled Vias / Hole | Connection top to bottom circuitry or to ground |
| Dielectric | Protection for underlying circuitry |
| Edge Plating / Printing | Connection to surface mount resistors |
| Thick Film Printed Resistors | Alternative to surface mount resistors |
| Overglaze | Protection for underlying circuitry |
| Ceramic Standard Substrates | Surface Finish |
|---|
| 91% Alumina | As Fired, Lapped, Polished |
| 92% Alumina | As Fired, Lapped, Polished |
| 96% Alumina | As Fired, Lapped, Polished |
| 99.6% Alumina | As Fired, Lapped, Polished |
| Aluminum Nitride (Aln) | Lapped, Polished |
| Beryllium Oxide (BeO) | As Fired, Lapped |
| Specialty Substrates | Surface Finish |
|---|
| Ferrite | Lapped, Polished |
| Glass | Lapped, Polished |
| Macor | Lapped, Polished |
| Quartz | Lapped, Polished |
| Substrate Processing | Info |
|---|
| Laser Scribe | Single / Array |
| Laser Drill | Vias / Holes |
| Laser Machining | Per Specification |
| Diamond Saw Cut | +/- .002″ Tolerance |
| Assembly | Ceramic, PCB, other board types |
|---|
Surface Mount (SMT):
-Conductive, Non Conductive epoxy
-Solder reflow
-Solder lead / pin attachment | Circuit population using active & passive components |
| Wire Bonding | Die attach circuit populationg-semiconductors |
|---|
| Gold ball | .001″-.003″ mil wire |
| Gold wedge | .0005″-.003″ mil wire |
| Aluminum wedge | .001″-.003″ mil wire |
| Product Testing/Measurement | On HTI-Produced Units |
|---|
| Physical Dimensions(ceramic) | Verify conforming to customer specification |
| Continuity / Netlist Connection integrity | Resistor Measurement Value verification / Data Recorded |
| Metallization Adhesion | Leach resistance (verify adhesion) |
| Trace Thickness & Width (conductor, etc) | Verify conforming to customer specification |
| Wire Bond Qualification / Pull Testing | Bond strength |
| Wire Bond Qualification / Shear Testing | Bond strength |
| Burn-in | Circuit stabilization |
| Performance | Design confirmation |
| Environmental | Endurance verification |
| Leak Testing Using Fluid | Verify Hermetic seal |
| | |
|---|
| Engineering/Support/CAD | Leading to HTI circuit fabrication |
| Circuit Conversion | Convert from PCB (G10/FR4) |
| Artwork Generation | For circuit pattern definition |
| Advanced Processes | Ceramic-based circuits / items |
|---|
| Packaging, Potting & Encapsulation | Ceramic, Glass Fiber Filled Plastic, Diallyx Phthalate |
| Ceramic Glass Sealing | Ceramic Packages |
| Photo Patterned Thick Film (Etched) | Fine Line Geometries (0.0015″):
-High Speed Circuits (>50GHz)
-High Density Circuits
-High Temperature Circuit |
| Plated up thick film circuits | High Current/High Power:
-Ni, Cu, Au
|